SAN JOSE, Calif.–(BUSINESS WIRE)–Oct. 28, 2015– InvenSense, Inc. (NYSE:INVN), the leading provider of MEMS sensor platforms, today announced it has released for OEM review UltraPrint^™, its ultrasonic fingerprint imaging solution, manufactured on the proprietary InvenSense CMOS-MEMS Platform (ICMP), offering ramp to production in calendar year 2017. As the world’s largest fabless MEMS SOC innovator and source for the eutectically bonded ICMP, InvenSense ships, on average, over twelve million motion or audio sensor SOCs each week to leading global mobile and IoT OEMs.

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